ZENI

ZENI

Zeni

A Packaging for IC Chips

A Packaging for IC Chips

ZENI is a packaging redesign project that simplifies how single IC electronic

components are stored, labeled, and used. It aims to make handling small

electronic parts more organized, intuitive, and sustainable for students,

hobbyists, and professionals.

What if packaging made learning easier ?


Safer and compact?

Safer and compact?

Beginner Friendly?

Beginner Friendly?

Instructive?

Instructive?

Who?

For anyone who needs electronic parts

to be safer, clearer, and easier to store.

(students, hobbyists, and shopkeepers)

For anyone who needs electronic parts

to be safer, clearer, and easier to store.

(students, hobbyists, and shopkeepers)

What?


A packaging that stores, organizes and guides.


(Shops selling single ICs.
Drawers and pouches where parts get lost.
Workbenches of students, hobbyists, and beginners.)


A packaging that stores, organizes and guides.


(Shops selling single ICs.
Drawers and pouches where parts get lost.
Workbenches of students, hobbyists, and beginners.)

How?

Designed with responsibility: minimal plastic,
Simple die-cuts for easy manufacturing,
Tested protection for real use,
Clear labels with QR codes for guidance.

Designed with responsibility: minimal plastic,
Simple die-cuts for easy manufacturing,
Tested protection for real use,
Clear labels with QR codes for guidance.

Secondary Reserch

Conducted user survey through online and in person interview of professionals to students

Roll Packaging

Ammo Packaging

Tape and Reel Packaging

Blister packaging

Tubes / Ammo tubes

Plastic box

Thermocol

Interview

Conducted user survey through online and in person interview of

professionals to students

48

users

Interviewed

12

working

professionals

36

college

students

Conducted user survey through online and in person interview of professionals to students

If you were able to buy them in sets, how

many components would you prefer in

each set

How many IC’s would you usually buy

Do you feel the need for instructions and

labels on the packaging

Primary Reserch

Conducted user survey through online and in person interview of

professionals to students

Pocket Problem
Chips carried loose in

pockets get bent or

damaged before use.

Vision Problem

Small, faint markings make

components hard to read,

especially for beginners or those

with weak eyesight.

Drawer Problem
 Parts stored in pouches or

drawers mix easily, and

labels are lost.

Shop Problem
 Loose sales from bulk bags cause

mix-ups, spills, and mistrust

between buyer and seller.

Waste Problem
Most packaging is single-use

plastic torn once, thrown

away, with no storage value.

Design

Opportunities


1. Protection + Reuse

2. Clarity + Guidance

3. Responsibility in Materials

4. Standardization for Trust

5. Informative Packaging

Use Cases

Campus counters and local

electronic shops, where single

ICs are sold one at a time, often

loose or mixed.

Beginners learning electronics

Children, learners, or people with

weak eyesight — struggling to read

tiny labels and connect

datasheets to real parts.

Shopkeepers and technicians
Handling high volumes of small

parts, needing a simple, safe

system for sorting and selling.

Rendered in Blender

Objective

Create accessible packaging for teenagers (16–25) exploring electronics. Current products lack

clear packaging, user manuals, and safety guidance, forcing users to rely on external sources.

Adding clear instructions and brand value will enhance safety, usability, and overall experience.

Design Brief

Design Brief

Design a minimal package with clear product information and a simple user guide for IC chips, ensuring

readability, safety, and ease of use for students and new customers.

Initial sketching and form finding.

Prototypes

1:1 sized prototypes made using

paper, wood. and foamboard.

Two Finalized Prototypes

FINALIZED

This prototype was finalized for its

small size, efficiency and functional

reliability.

This prototype was finalized for its

small size, efficiency and functional

reliability.

REJECTED

REJECTED

This prototype was second on the list,

but rejected for its tiny parts and

small complexities, thereby making it

less mass manufacturable.

This prototype was second on the list,

but rejected for its tiny parts and

small complexities, thereby making it

less mass manufacturable.

This prototype was second on the list,

but rejected for its tiny parts and

small complexities, thereby making it

less mass manufacturable.

More renders of the rejected prototype, just because :)

Render on Blender.

Final Packaging: