
Projects


A Packaging for IC Chips
ZENI is a packaging redesign project that simplifies how single IC electronic
components are stored, labeled, and used. It aims to make handling small
electronic parts more organized, intuitive, and sustainable for students,
hobbyists, and professionals.


Safer and compact?
Beginner Friendly?


Instructive?





















































This prototype was finalized for its
small size, efficiency and functional
reliability.




This prototype was second on the list,
but rejected for its tiny parts and
small complexities, thereby making it
expensive to mass manufacture.


























